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Author (up) Orr, R.S. et al; Lacasta, C.; Solaz, C.; Soldevila, U. doi  openurl
  Title Quality Assurance during production of the ATLAS18 ITk strip sensors Type Journal Article
  Year 2026 Publication Nuclear Instruments & Methods in Physics Research A Abbreviated Journal Nucl. Instrum. Methods Phys. Res. A  
  Volume 1092 Issue Pages 171920 - 8pp  
  Keywords LHC; ITk; ATLAS; Sensors; Quality assurance  
  Abstract We describe the extensive quality assurance programme undertaken during the production of the ATLAS ITk strip sensors. Quality Assurance (QA) is the systematic process of preventing defects during production, rather than identifying them after the fact. QA is performed on test structures fabricated at the periphery of the same wafers used to produce the actual sensors, thus ensuring that these structures are a good representation of the sensor and process quality. The test structures consist of test chips, which include strips, diodes, MOS capacitors, and special structures for monitoring of parameters such as bias resistor values, interstrip resistance, coupling capacitance and flat band voltage. Additionally, miniature sensors with the same design as the main sensor, but with reduced area, allow measurement of the charge generated during irradiation with a beta source. Test structure semiconductor parameters are measured on both unirradiated samples and samples subjected to irradiation. The test chips are irradiated using gammas and reactor neutrons to the equivalent dose (660 kGy) and fluence (1.6 & times;1015 neq/cm2) expected in the high luminosity-LHC after 1.5 times its lifetime of 14 years. Miniature sensors are irradiated to the same neutron fluence as the test chips, or the equivalent proton fluence. Monitor diodes are irradiated alternatively to the maximum fluence to measure the degradation of the leakage current, and to one third this value to observe the full depletion voltage within the operational range of the measurement setups. Unirradiated test structures are measured on a probe station at room temperature. Irradiated test structures are wire-bonded to a PCB to provide connectivity, and measured at-21 degrees C and 4% relative humidity.  
  Address [Orr, R. s.; Bhardwaj, A.; Crick, B.; Epstein, U.; Hill, E. c.; Knight, T.; Pyavka, S.; Vansteenkiste, M.; Wishart, P.] Univ Toronto, Dept Phys, 60 St George St, Toronto, ON M5S 1A7, Canada; [Fleta, C.; Bach, E.; Fernandez-Tejero, J.; Ullan, M.; Valero, D.] CSIC, Ctr Nacl Microelect IMB CNM, Campus UAB, Bellaterra 08193, Barcelona, Spain; [Allport, P. p.; Chisholm, A. s.; Liu, E.; Lomas, J.; Skorda, E.; Thory-Rao, T. m.] Univ Birmingham, Sch Phys & Astron, Birmingham B15 2TT, England; [Awais, A.; Beck, G. a.; Bevan, A. j.; Chen, Z.; Dawson, I.; Gregorio, R. R. Marcelo; Miyagawa, P. s.; Zenz, S. c.] Queen Mary Univ London, Particle Phys Res Ctr, GO Jones Bldg,Mile End Rd, London E1 4NS, England; [Bernabeu, P.; Lacasta, C.; Solaz, C.; Soldevila, U.] IFIC CSIC UV, Inst Fis Corpuscular, C-Catedrat Jose Beltran 2, E-46980 Paterna, Valencia, Spain; [Cindro, V.; Mandic, I.; Novak, B.] Jozef Stefan Inst, Expt Particle Phys Dept, Jamova 39, SI-1000 Ljubljana, Slovenia; [Fadeyev, V.] Univ Calif Santa Cruz, Santa Cruz Inst Particle Phys SCIPP, Santa Cruz, CA 95064 USA; [Federicova, P.; Kozakova, J.; Kroll, J.; Kvasnicka, J.; Mikestikova, M.; Tuma, P.] Czech Acad Sci, Inst Phys, Na Slovance 2, Prague 8, Czech Republic; [Gallus, P.] UJP PRAHA As, Nad Kaminkou 1345, Praha Zbraslav 15600, Czech Republic; [Nakamura, K.; Unno, Y.] High Energy Accelerator Res Org KEK, Inst Particle & Nucl Study, 1-1 Oho, Tsukuba, Ibaraki 3050801, Japan; [Kopsalis, I.] Natl Tech Univ Athens, Dept Phys, 9 Iroon Polytech St,Zografou Campus, Athens 15780, Greece; [Hirose, S.; Maeyama, K.; Sato, K.] Univ Tsukuba, Inst Pure & Appl Sci, 1-1-1 Tennodai, Tsukuba, Ibaraki 3058571, Japan; [Klein, C. t.] Carleton Univ, Phys Dept, Ottawa, ON K1S 5B6, Canada, Email: robert.orr@utoronto.ca  
  Corporate Author Thesis  
  Publisher Elsevier Place of Publication Editor  
  Language English Summary Language Original Title  
  Series Editor Series Title Abbreviated Series Title  
  Series Volume Series Issue Edition  
  ISSN 0168-9002 ISBN Medium  
  Area Expedition Conference  
  Notes WOS:001844302900001 Approved no  
  Is ISI yes International Collaboration yes  
  Call Number IFIC @ pastor @ Serial 7377  
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