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Author  |
Abramowicz, H.; Almanza Soto, M.; Benhammou, Y.; Elad, M.; Firlej, M.; Fiutowski, T.; Ghenescu, V.; Grzelak, G.; Horn, D.; Huang, S.; Idzik, M.; Irles, A.; Levy, A.; Levy, I.; Lohmann, W.; Moron, J.; Neagu, A.T.; Pietruch, D.; Potlog, P.M.; Swientek, K.; Zarnecki, A.F.; Zembaczynski, K. |
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Title |
Novel silicon and GaAs sensors for compact sampling calorimeters |
Type |
Journal Article |
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Year |
2025 |
Publication |
European Physical Journal C |
Abbreviated Journal |
Eur. Phys. J. C |
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Volume |
85 |
Issue |
6 |
Pages |
684 - 13pp |
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Keywords |
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Abstract |
Two samples of silicon pad sensors and two samples of GaAs sensors are studied in an electron beam with 5 GeV energy from the DESY-II test-beam facility. The sizes of the silicon and GaAs sensors are about 9 x\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\times $$\end{document} 9 cm2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\hbox {cm}<^>2$$\end{document} and 5 x\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\times $$\end{document} 8 cm2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\hbox {cm}<^>2$$\end{document}, respectively. The thickness is 500 μm for both the silicon and GaAs sensors. The pad size is about 5 x\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\times $$\end{document} 5 mm2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$\hbox {mm}<^>2$$\end{document}. The sensors are foreseen to be used in a compact electromagnetic sampling calorimeter. The readout of the pads is done via traces connected to the pads and the front-end ASICs at the edges of the sensors. For the silicon sensors, copper traces on a Kapton foil are connected to the sensor pads with conducting glue. The pads of the GaAs sensors are connected to bond-pads via aluminium traces on the sensor substrate. The readout is based on a dedicated front-end ASIC, called FLAME. Pre-processing of the raw data and deconvolution is performed with FPGAs. The whole system is orchestrated by a Trigger Logic Unit. Results are shown for the signal-to-noise ratio, the homogeneity of the response, edge effects on pads, cross talk and wrongly assigned signals due to the readout traces. |
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Address |
[Abramowicz, H.; Benhammou, Y.; Elad, M.; Horn, D.; Huang, S.; Levy, A.; Levy, I.] Tel Aviv Univ, Sch Phys & Astron, IL-69978 Tel Aviv, Israel, Email: wolfgang.lohmann@desy.de |
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Thesis |
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Publisher |
Springer |
Place of Publication |
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Language |
English |
Summary Language |
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Original Title |
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Series Editor |
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Series Title |
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Abbreviated Series Title |
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Series Volume |
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Edition |
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ISSN |
1434-6044 |
ISBN |
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Notes |
WOS:001512883600001 |
Approved |
no |
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Is ISI |
yes |
International Collaboration |
yes |
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Call Number |
IFIC @ pastor @ |
Serial |
6713 |
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