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Belle-II DEPFET and PXD Collaborations(Ahlburg, P. et al), & Marinas, C. (2024). The new and complete Belle II DEPFET pixel detector: Commissioning and previous operational experience. Nucl. Instrum. Methods Phys. Res. A, 1068, 169763–6pp.
Abstract: The Belle II experiment at the SuperKEKB collider in Tsukuba, Japan, has collected e+e- + e – collision data between 2019 and 2022. After reaching a record-breaking instantaneous luminosity of 4.71x1034 . 71x10 34 cm -2 s -1 and recording a dataset corresponding to 424 fb -1 , it completed its first planned long shutdown phase in December 2023. Aside from upgrades of the collider and detector maintenance, the shutdown was used for the installation of the two-layer Pixel VerteX Detector (PXD). As the innermost sub-detector, multiple scattering effects need to be reduced. PXD utilizes the Depleted P-channel Field Effect Transistor (DEPFET) technology, allowing for a material budget of 0.21% X0 0 per layer. Each of the tracker's 40 modules consists of an array of 250x768 pixels with a pitch ranging from 50 μmx 55 μm for the inner to 85 μmx 55 μm for the outer layer yielding high gain and high signal-to-noise ratio while retaining about 99% hit efficiency. This article discusses the experience of the 4-year operation of the previous single-layer PXD in harsh background conditions as well as commissioning and testing of the fully-populated PXD2 during Long Shutdown 1.
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Babeluk, M. et al, Lacasta, C., Marinas, C., Mazorra de Cos, J., & Vobbilisetti, V. (2024). The OBELIX chip for the Belle II VTX upgrade. Nucl. Instrum. Methods Phys. Res. A, 1067, 169659–3pp.
Abstract: The OBELIX depleted monolithic active CMOS pixel sensor (DMAPS) is currently developed for the upgrade of the vertex detector of the Belle II experiment located at Tsukuba/Japan. The pixel matrix of OBELIX is inherited from the TJ-Monopix2 chip, but the periphery includes additional features to improve performance and allow the integration into a larger detector system. The new features include a trigger unit to process trigger signals, a precision timing module and a possibility to transmit low granularity hit information with low latency to contribute to the Belle II trigger. Additionally, low dropout voltage regulators and an ADC to monitor power consumption and substrate temperature is developed. This paper will focus on the trigger contribution capabilities of the OBELIX chip.
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Belle II VTX Collaboration(Babeluk, M. et al)., Marinas, C., & Mazorra de Cos, J. (2024). The DMAPS upgrade of the Belle II vertex detector. Nucl. Instrum. Methods Phys. Res. A, 1064, 169428–5pp.
Abstract: The Belle II experiment at KEK in Japan considers an upgrade for the vertex detector system in line with the accelerator upgrade for higher luminosity at long shutdown 2 planned for 2028. One proposal for the upgrade of the vertex detector called VTX aims to improve background robustness and reduce occupancy using small and fast pixels. VTX accommodates the OBELIX depleted monolithic active CMOS pixel sensor (DMAPS) on all five proposed layers. OBELIX is specifically developed for the VTX application and based on the TJ-Monopix2 chip initially developed to meet the requirements of the outer layers of the ATLAS inner tracker (ITk). This paper will review recent tests of the TJ-Monopix2 chip as well as various design aspects of the OBELIX-1 chip currently under development.
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Natochii, A. et al, & Marinas, C. (2023). Measured and projected beam backgrounds in the Belle II experiment at the SuperKEKB collider. Nucl. Instrum. Methods Phys. Res. A, 1055, 168550–21pp.
Abstract: The Belle II experiment at the SuperKEKB electron-positron collider aims to collect an unprecedented data set of 50 ab-1 to study CP-violation in the B-meson system and to search for Physics beyond the Standard Model. SuperKEKB is already the world's highest-luminosity collider. In order to collect the planned data set within approximately one decade, the target is to reach a peak luminosity of 6 x 1035 cm-2 s-1by further increasing the beam currents and reducing the beam size at the interaction point by squeezing the betatron function down to betay* = 0.3 mm. To ensure detector longevity and maintain good reconstruction performance, beam backgrounds must remain well controlled. We report on current background rates in Belle II and compare these against simulation. We find that a number of recent refinements have significantly improved the background simulation accuracy. Finally, we estimate the safety margins going forward. We predict that backgrounds should remain high but acceptable until a luminosity of at least 2.8 x 1035 cm-2 s-1is reached for betay* = 0.6 mm. At this point, the most vulnerable Belle II detectors, the Time-of-Propagation (TOP) particle identification system and the Central Drift Chamber (CDC), have predicted background hit rates from single-beam and luminosity backgrounds that add up to approximately half of the maximum acceptable rates.
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Babeluk, M. et al, & Marinas, C. (2023). CMOS MAPS upgrade for the Belle II Vertex Detector. Nucl. Instrum. Methods Phys. Res. A, 1048, 168015–5pp.
Abstract: The success of the Belle II experiment in Japan relies on the very high instantaneous luminosity, close to 6x1035 cm-2 s-1, expected from the SuperKEKB collider. The corresponding beam conditions at such luminosity levels generate large rates of background particles and creates stringent constraints on the vertex detector, adding to the physics requirements. Current prospects for the occupancy rates in the present vertex detector (VXD) at full luminosity fall close to the acceptable limits and bear large uncertainties. In this context, the Belle II collaboration is considering the possibility to install an upgraded VXD system around 2027 to provide a sufficient safety margin with respect to the expected background rate and possibly enhance tracking and vertexing performance. The VTX collaboration has started the design of a fully pixelated VXD, called VTX, based on fast and highly granular Depleted Monolithic Active Pixel Sensors (DMAPS) integrated on light support structures. The two main technical features of the VTX proposal are the usage of a single sensor type over all the layers of the system and the overall material budget below 2% of radiation length, compared to the current VXD which has two different sensor technologies and about 3% of radiation length. A dedicated sensor (OBELIX), taylored to the specific needs of Belle II, is under development, evolving from the existing TJ-Monopix2 sensor. The time-stamping precision below 100 ns will allow all VTX layers to take part in the track finding strategy contrary to the current situation. The first two detection layers are designed according to a self-supported all-silicon ladder concept, where 4 contiguous sensors are diced out of a wafer, thinned and interconnected with post-processed redistribution layers. The outermost detection layers follow a more conventional approach with a cold plate and carbon fibre support structure, and light flex cables interconnecting the sensors. This document will review the context, technical details and development status of the proposed Belle II VTX.
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Liptak, Z. et al, & Marinas, C. (2022). Measurements of beam backgrounds in SuperKEKB Phase 2. Nucl. Instrum. Methods Phys. Res. A, 1040, 167168–19pp.
Abstract: The high design luminosity of the SuperKEKB electron–positron collider will result in challenging levels of beam-induced backgrounds in the interaction region. Understanding and mitigating these backgrounds is critical to the success of the Belle II experiment. We report on the first background measurements performed after roll-in of the Belle II detector, a period known as SuperKEKB Phase 2, utilizing both the BEAST II system of dedicated background detectors and the Belle II detector itself. We also report on first revisions to the background simulation made in response to our findings. Backgrounds measured include contributions from synchrotron radiation, beam-gas, Touschek, and injection backgrounds. At the end of Phase 2, single-beam backgrounds originating from the 4 GeV positron Low Energy Ring (LER) agree reasonably well with simulation, while backgrounds from the 7 GeV electron High Energy Ring (HER) are approximately one order of magnitude higher than simulation. We extrapolate these backgrounds forward and conclude it is safe to install the Belle II vertex detector.
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Belle-II DEPFET and PXD Collaborations(Wang, B. et al), & Marinas, C. (2022). Operational experience of the Belle II pixel detector. Nucl. Instrum. Methods Phys. Res. A, 1032, 166631–7pp.
Abstract: The Belle II experiment at the SuperKEKB accelerator has started its physics data taking with the full detector setup in March 2019. It aims to collect 40 times more e+e- collision data compared with its predecessor Belle experiment. The Belle II pixel detector (PXD) is based on the Depleted P-channel Field Effect Transistor (DEPFET) technology. The PXD plays an important role in the tracking and vertexing of the Belle II detector. Its two layers are arranged at radii of 14 mm and 22 mm around the interaction point. The sensors are thinned down to 75 μm to minimize multiple scattering, and each module has interconnects and ASICs integrated on the sensor with silicon frames for mechanical support. PXD showed good performance during data taking. It also faces several operational challenges due to the high background level from the SuperKEKB accelerator, such as the damage from beam loss events, the drift in the HV working point due to radiation effect, and the impact of the high background.
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Wieduwilt, P., Paschen, B., Schreeck, H., Schwenker, B., Soltau, J., Ahlburg, P., et al. (2021). Performance of production modules of the Belle II pixel detector in a high-energy particle beam. Nucl. Instrum. Methods Phys. Res. A, 991, 164978–15pp.
Abstract: The Belle II experiment at the Super B factory SuperKEKB, an asymmetric e(+) e(-) collider located in Tsukuba, Japan, is tailored to perform precision B physics measurements. The centre of mass energy of the collisions is equal to the rest mass of the gamma (4S) resonance of m(gamma(4S)) = 10.58 GeV. A high vertex resolution is essential for measuring the decay vertices of B mesons. Typical momenta of the decay products are ranging from a few tens of MeV to a few GeV and multiple scattering has a significant impact on the vertex resolution. The VerteX Detector (VXD) for Belle II is therefore designed to have as little material as possible inside the acceptance region. Especially the innermost two layers, populated by the PiXel Detector (PXD), have to be ultra-thin. The PXD is based on DEpleted P-channel Field Effect Transistors (DEPFETs) with a thickness of only 75 μm. Spatial resolution and hit efficiency of production detector modules were studied in beam tests performed at the DESY test beam facility. The spatial resolution was investigated as a function of the incidence angle and improvements due to charge sharing are demonstrated. The measured module performance is compatible with the requirements for Belle II.
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Schreeck, H., Paschen, B., Wieduwilt, P., Ahlburg, P., Andricek, L., Dingfelder, J., et al. (2020). Effects of gamma irradiation on DEPFET pixel sensors for the Belle II experiment. Nucl. Instrum. Methods Phys. Res. A, 959, 163522–9pp.
Abstract: For the Belle II experiment at KEK (Tsukuba, Japan) the KEKB accelerator was upgraded to deliver a 40 times larger instantaneous luminosity than before, which requires an increased radiation hardness of the detector components. As the innermost part of the Belle II detector, the pixel detector (PXD), based on DEPFET (DEpleted P-channel Field Effect Transistor) technology, is most exposed to radiation from the accelerator. An irradiation campaign was performed to verify that the PXD can cope with the expected amount of radiation. We present the results of this measurement campaign in which an X-ray machine was used to irradiate a single PXD half-ladder to a total dose of 266 kGy. The half-ladder is from the same batch as the half-ladders used for Belle II. According to simulations, the total accumulated dose corresponds to 7-10 years of Belle II operation. While individual components have been irradiated before, this campaign is the first full system irradiation. We discuss the effects on the DEPFET sensors, as well as the performance of the front-end electronics. In addition, we present efficiency studies of the half-ladder from beam tests performed before and after the irradiation.
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Marinas, C., & Vos, M. (2011). The Belle-II DEPFET pixel detector: A step forward in vertexing in the superKEKB flavour factory. Nucl. Instrum. Methods Phys. Res. A, 650(1), 59–63.
Abstract: An upgrade of the successful asymmetric e(+)e(-) collider in KEK (Tsukuba, Japan) is foreseen by the fall of 2013. This new Super Flavor Factory will deliver an increased instantaneous luminosity of up to L = 8 x 10(35) cm(-2) s(-1), 40 times larger than the current KEKB machine. To exploit these new conditions and provide high precision measurements of the decay vertex of the B meson systems, a new silicon vertex detector will be operated in Belle. This new detector will consist of two layers of DEPFET Active Pixel Sensors as close as possible to the interaction point. DEPFET is a field effect transistor, with an additional deep implant underneath the channel's gate, integrated on a completely depleted bulk. This technology offers detection and an in-pixel amplification stage, while keeping low the power consumption. Under these conditions, thin sensors with small pixel size and low intrinsic noise are possible. In this article, an overview of the full system will be described, including the sensor, the front-end electronics and both the mechanical and thermal proposed solutions as well as the expected performance.
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